TDK InvenSense MOD-CH101 Ultrasonic ToF Sensor Module
TDK InvenSense MOD-CH101 Ultrasonic Time-of-Flight (ToF) Sensor Module contains a CH-101 sensor on a small printed circuit board. Based on Chirp’s patented MEMS technology, the CH-101 is a system-in-package that integrates a PMUT (piezoelectric micromachined ultrasonic transducer) with an ultra-low-power SoC (system on chip) in a miniature, reflowable package. The SoC runs Chirp’s advanced ultrasonic DSP algorithms and includes an integrated microcontroller that provides digital range readings via I2C.
The CH-101 provides accurate range measurements to targets at distances up to 1.2m. The sensor works in any lighting conditions, including sunlight by using ultrasonic pulse-echo measurements and provides millimeter-accurate range measurements independent of the target’s color and optical transparency. The sensor’s wide Field-of-View (FoV) enables simultaneous range measurements of multiple objects in the FoV. The TDK InvenSense MOD_CH101-03-01 sensor module includes an omnidirectional acoustic housing with a 0.7mm diameter acoustic port and a 5.3mm outer diameter.
Features
- Ultralow power
- Fast and accurate range measurement regardless of target size
- Detects any color objects, including windows and glass doors and walls
- Easy to integrate
- Miniature, integrated module
- Customizable field of view (FoV)
Applications
- Augmented and virtual reality
- Drones and robotics
- Mobile and computing devices
- Obstacle avoidance
- Printers and scanners
- Proximity sensing
- Presence detection
- Smart home
CH101 Sensors
TDK InvenSense CH101 Distance Sensor
Ultra-low-power ultrasonic ToF range sensors that are based on Chirp’s patented MEMS technology.
Development Kit
TDK InvenSense DK-CH101 SmartSonic™ Platform
A comprehensive development platform for CH-101, a miniature ultrasonic time-of-flight range sensor.
Additional Resources
- CH-101 Datasheet
- CH-101 Mechanical Integration Guide
- CH-101 Example Driver Hands On
- MOD_CH101-03-01 Retrofit with 45° FoV Horn
- AH-10133-045045MR Acoustic Housing Brief
- CH101 and CH201 SmartSonic Evaluation Kit User Guide
- Ultrasonic Module Pulse-Echo Test Procedure
- CH101 and CH201 Ultrasonic Transceiver Handling and Assembly Guidelines
- Chirp Microsystems SonicLib Programmer’s Guide
Related Modules
TDK InvenSense MOD_CH101 Distance Sensor Module
Functional for prototyping and small-scale production that is not extremely space-constrained.
TDK InvenSense Chirp Products
A family of miniature and ultra-low power ultrasonic Time-of-Flight (ToF) range sensors and modules.