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Texas Instruments CC2564MODNEM Dual-Mode Bluetooth Evaluation Board

Texas Instruments CC2564MODNEM Dual-Mode Bluetooth Evaluation Board contains the CC2564MODN device and is intended for evaluation and design purposes. The CC2564MODNEM board plugs directly into the TI hardware development kits: MSP-EXP430F5529, MSP-EXP430F5438, DK-TM4C123G, DK-TM4C129X, and other MCUs. A certified and royalty-free TI Bluetooth Stack is available for the MSP430 (CC256XMSPBTBLESW), TM4C12x MCUs (CC256XM4BTBLESW) and other MCUs (CC256XSTBTBLESW). The CC2564MODNEM hardware design files (schematics, layout, and BOM) are provided as a reference to aid in the implementation of the CC2564MODN device.

Features

  • CC2564MODN device (MOE package)
  • Bluetooth Specification v4.1
  • Dual Mode - BLUETOOTH® and Bluetooth low energy
  • FCC, IC, CE certified
  • Class 1.5 Transmit Power (+10dBm)
  • High sensitivity (-93dBm typ.)
  • UART Interface - Control and Data
  • 1.8 LDO (LP2985-18)
  • 3 Voltage level translators (SN74AVC4T774)
  • RF connector (U.FL-R-SMT-1)
  • PCM/I2S Interface - Voice and Audio
  • 4 Layer PCB design
  • EM connectors that plug directly into the TI hardware development kits:
  • Certified and royalty-free TI Bluetooth Stack

Kit Contents

  • CC2564MODNEM board with TI CC2564 module
  • Jumper for MSP-EXP430F5438 board
  • 4 Jumpers for MSP-EXP430F5529 board
Published: 2016-03-23 | Updated: 2025-03-06