TE Connectivity Sliver Internal Cabled Interconnect Solution

TE Connectivity's (TE) Sliver Internal Cabled Interconnect Solution is designed to be a flexible solution for making internal I/O connections on the board, up to 25Gbps. TE Sliver connectors serve many applications, data rates, and protocols (PCI Express, SAS, and Ethernet). With a 0.6mm contact pitch, Sliver connectors are super slim, allowing designers to fit more inside the box. The series includes a highly robust metal housing design on the connector cage. An active latch on the housing provides additional connection security. These connectors reach up to 25Gbps speed with the use of TE high-speed cable.

The Sliver internal I/O plug kits are available in 50pin, 74pin, and 124pin variants with a retention force of 35N (minimum). Each of these variants are built with polycarbonate contact housing and stainless steel active latches. The 50pin plug kit features 29N (maximum) mating force and is designed to accommodate 33AWG cables. The 74pin plug kit features 38N (maximum) mating force and is designed to accommodate 33AWG cables. The 124pin plug kit features 57N (maximum) mating force and is designed to accommodate 30 and 33AWG cables.

Features

  • 0.6mm pitch SMT connector design includes robust metal housing
  • 12G and 25G high speed, low-loss 33AWG cable
  • Vertical and right-angle configurations with an active latch
  • Supports 85Ω and 100Ω impedance applications
  • Flexible pinout arrangement allows for a mix of differential signal pairs and low-speed single-ended sidebands
  • Flexible mounting and mating arrangements:
    • Cabled interconnects
    • Card edge interconnects
    • Mating
    • Vertical to right-angle
    • Vertical to straight
    • Right-angle to right-angle
    • Right-angle to straight receptacle-to-plug
  • Scalable in x4 Tx/Rx lane increments:
    • x4 (26pin)
    • x8 (50pin)
    • x12 (74pin)
    • x16 (100pin)
    • x20 (124pin)
    • x24 (148pin)
  • Supports present and future bandwidth needs without requiring re-qualification and redesign

Applications

  • Data center and networking equipment:
    • Servers
    • Switches
    • Routers
    • High-Performance Computing (HPC)
    • Storage devices
    • Wireless base stations and radios
  • Supports Ethernet, PCIe, SAS, SATA, InfiniBand, and other custom protocols
  • Internal cabled solution options
    • Chip to chip
    • Chip to I/O
    • Chip to backplane
    • Board to board
    • PCB Card Edge (BTB) solutions

TE's Sliver Interconnect Solution

TE Connectivity Sliver Internal Cabled Interconnect Solution

Sliver Internal I/O Plug Kits Exploded View

TE Connectivity Sliver Internal Cabled Interconnect Solution

Application Design Flexibility

TE Connectivity Sliver Internal Cabled Interconnect Solution

Videos

Published: 2017-03-06 | Updated: 2023-09-29