Molex QSFP-DD Interconnect System & Cable Assemblies
Molex QSFP-DD (Double Density) Interconnect System and Cable Assemblies feature an eight-lane electrical interface that transmits up to 28Gbps NRZ or 56Gbps PAM-4, up to 200Gbps or 400Gbps aggregate. QSFP-DD offers the same footprint as QSFP interconnects, making them backward compatible. The double density feature is an extended paddle card with two rows of high-speed context. Molex QSFP-DD meets IEEE 802.3bj, InfiniBand EDR, and SAS 3.0 specifications, allowing these connectors and cable assemblies to function across a variety of next-generation technologies and applications. The series includes sheet metal (stainless steel) EMI cages with increased robustness and cable assemblies in lengths ranging from 500mm to 2.5m.
Features
- 8-lane electrical interface transmits up to 28Gbps NRZ or 56Gbps PAM-4, up to 200Gbps or 400Gbps aggregate
- Same footprint as QSFP interconnects for backward compatibility
- 10MHz to 25GHz frequency
- 20°C to +85°C operating temperature range
- 32AWG or 30AWG cable sizes
- Meets IEEE 802.3bj, InfiniBand EDR, and SAS 3.0 specifications; functions across a variety of next-generation technologies and applications
- Temp-Flex cable technology to boost electrical performance
- Double density; extended paddle card with 2x rows of high-speed context
Applications
- Telecommunications equipment
- Servers
- Routers
- Switches
- Central office
- Cellular infrastructures
- Multi-platform service systems
- Data networking equipment
- Servers
- Storage
Videos
Additional Resources
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Published: 2019-01-30
| Updated: 2025-08-21