Infineon Technologies XENSIV™ MEMS Microphones
Infineon XENSIV™ MEMS Microphones are designed for applications requiring low self-noise (high SNR), wide dynamic range, distortions below 1% at 128dBSPL, and a high acoustic overload point. The microphones have a 70dB signal-to-noise ratio (SNR). The XENSIV™ MEMS Microphones offer crystal clear audio signals, an extended pick-up distance and sensitivity to both soft and loud signals in applications.
The microphones feature Dual Backplate MEMS technology, based on a miniaturised symmetrical microphone design, as utilised in studio condenser microphones. This results in high linearity of the output signal within a dynamic range of 95dB for the IM69D120 and 105dB for the IM69D130. This is combined with an exceptionally low distortion level of 10 percent at a sound pressure level (SPL) of 135dB.
Features
- Dynamic range of 105dB
- Signal-to-noise ratio of 69dB(A) SNR
- <1% total harmonic distortions up to 128dBSPL
- Acoustic overload point at 130dBSPL
- Sensitivity (± 1dB) and phase (± 2° @1kHz) matched
- Flat frequency response with low-frequency roll-off at 28Hz
- Very fast analogue-to-digital conversion speed (6μs latency @1kHz
- Power-optimised modes determined by PDM clock frequency
- Package dimensions: 4mm x 3mm x 1.2mm
- PDM output
- Omnidirectional pickup pattern
Applications
- Devices with voice user interface (VUI)
- Smart speakers
- Home automation
- IoT devices
- Active noise cancellation (ANC) headphones and earphones
- High-quality audio capturing
- Conference systems
- Cameras and camcorders
- Industrial or home monitoring with audio pattern detection
IM69D128S
Great signal-to-noise ratio (SNR) of 69dB(A) enables a crystal clear audio experience without compromising on battery life. Enabled by a revolutionary digital microphone ASIC, the IM69D128S sets a benchmark by cutting current consumption to 520μA – almost half of what models with similar performance on the market can offer. Additionally, IM69D128S masters the art of switching between different power and performance profiles without any audible artifacts, i.e., glitches that the user can hear.
IM70D122
High performance digital XENSIV MEMS microphone IM70D122 makes the most out of Infineon´s Sealed Dual Membrane technology to meet a very high signal-to-noise ratio of 70dB(A) and a very high sensitivity of -26dBFS. Especially thanks to its high sensitivity and high SNR, the IM70D122 is perfectly tailored for advanced audio capturing, which can uplift the audio experience for laptops, tablets, cameras, and conference systems.
IM73D122
Ultra-low noise digital XENSIV MEMS microphone IM73D122 is designed for applications that require a very high SNR (low self-noise) and high sensitivity. The flat frequency response (20Hz low-frequency roll-off) and tight manufacturing tolerance improve the performance of multi-microphone (array) applications. This microphone is based on Infineon's Sealed Dual Membrane MEMS technology, which delivers high ingress protection (IP57) at a microphone level.
IM68A130
The IM68A130 is a high-performance, single-ended, analog MEMS microphone designed for applications that require a low LFRO (10Hz), a high SNR (low self-noise), and low distortion (high AOP). The high signal-to-noise ratio (SNR) of 68dB(A) enables far-field and low-volume audio pick-up. The flat frequency response and tight manufacturing tolerance improve the performance of Active Noise Cancellation (ANC) and multi-microphone array applications.
IM70A135
Infineon’s XENSIV MEMS analog microphone IM70A135 is a compact, high-performance microphone with a very high acoustic overload point of 135dBSPL and a size of only 3.50mm x 2.65mm x 1.00mm3. This microphone is based on Infineon’s Sealed Dual Membrane MEMS technology, which delivers high ingress protection (IP57) at a microphone level. The small size makes this microphone especially suited for TWS earbud applications.
IM72D128V01
The IM72D128V01 is an ultra-high-performance digital microphone designed for applications that require a very high SNR (low self-noise) and low distortions (high AOP). This microphone is based on Infineon's Sealed Dual Membrane MEMS technology, which delivers high ingress protection (IP57) at a microphone level. The flat frequency response (20Hz low-frequency roll-off) and tight manufacturing tolerance improve the performance of multi-microphone (array) applications. Different power modes can be selected to suit specific clock frequencies and current consumption requirements.
IM69D127
IM69D127 is a digital high-performance MEMS microphone based on Infineon's Sealed Dual Membrane MEMS technology, which delivers high ingress protection (IP57) at a microphone level. Its small size of only 3.60mm x 2.50mm x 1.00mm3 makes it a perfect match for compact audio devices, like TWS earbuds.
IM73A135
Infineon’s XENSIV MEMS analog microphone IM73A135 features a signal-to-noise ratio (SNR) of 73dB and a high acoustic overload point of 135dBSPL to enable clear audio pick-up of the quietest and the loudest sounds. The IM73A135 allows designers to reach a level of high audio performance that was previously only achievable by ECMs while at the same time reaping the benefits inherent in MEMS technology.
Audiohub Nano
The Infineon Audiohub Nano Analogs EVAL AHNB ANALOGV01 enables the evaluation of Infineon analog XENSIV MEMS microphones. The kit includes an Infineon Audiohub Nano and four analog microphones on a flex board. Up to two Infineon analog XENSIV MEMS microphones can be connected to the mono or stereo output evaluation board. The evaluation board provides a USB audio interface to stream audio data from the microphone with any audio recording and editing software.
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