W25M512JVFIQ

Winbond
454-W25M512JVFIQ
W25M512JVFIQ

Mfr.:

Description:
Multichip Packages spiFlash, 512M-bit, 4Kb Uniform Sector

Lifecycle:
Verify Status with Factory:
Lifecycle information is unclear. Obtain a quote to verify the availability of this part number from the manufacturer.
Datasheet:
ECAD Model:
Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.
More Information
Learn more about Winbond W25M512JVFIQ

In Stock: 62

Stock:
62 Can Dispatch Immediately
Factory Lead Time:
53 Weeks Estimated factory production time for quantities greater than shown.
Quantities greater than 62 will be subject to minimum order requirements.
Long lead time reported on this product.
Minimum: 1   Multiples: 1   Maximum: 62
Unit Price:
€-.--
Ext. Price:
€-.--
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
€6.54 €6.54
€6.09 €60.90
€5.91 €147.75
€5.72 €286.00

Product Attribute Attribute Value Select Attribute
Winbond
Product Category: Multichip Packages
RoHS:  
Serial NOR Flash
512 Mbit
SOIC-16
W25M512JV
SMD/SMT
104 MHz
- 40 C
+ 85 C
Brand: Winbond
Data Bus Width: 8 bit
Interface Type: SPI
Moisture Sensitive: Yes
Organisation: 64 M x 8
Packaging: Tray
Product Type: Multichip Packages
Factory Pack Quantity: 176
Subcategory: Memory & Data Storage
Supply Voltage - Max: 3.6 V
Supply Voltage - Min: 2.7 V
Tradename: SpiStack
Unit Weight: 6.820 g
Products found:
To show similar products, select at least one checkbox
Select at least one checkbox above to show similar products in this category.
Attributes selected: 0

CNHTS:
8542329090
USHTS:
8542320051
ECCN:
3A991.b.1.a

Serial MCP Flash Portfolio with SpiStack®

Winbond Serial MCP Flash Portfolio with SpiStack® is based on the W25Q/W25N SpiFlash® series by stacking W25Q16JV and W25N01GV. The portfolio offers flexible memory density and reliability combinations for the low pin count package and Concurrent Operations in Serial Flash memory for the first time. Winbond W25M SpiStack series is ideal for small form factor system designs and applications that demand high Program/Erase data throughput. The series comprises a 1.8V NAND Flash Memory device and a 1.8V Low Power SDRAM device. MCP is an all-in-one package that provides an effective solution for saving Printed Circuit Board (PCB) space. This benefit becomes more critical in small PCBs for modules and space-critical designs, particularly for mobile and portable applications.

FEATURED PRODUCTS
WINBOND

Supplier Image
View All Newest Products from Winbond

An unexpected error has occurred.


Have a question? Please visit the Help Centre.
For questions about a specific order, please log in to your account.

If you encounter further problems, please contact us on 800-346-6873 or email help@mouser.com.