MDEV-A-900-PRO

TE Connectivity / Linx Technologies
712-MDEV-A-900-PRO
MDEV-A-900-PRO

Mfr.:

Description:
Sub-GHz Development Tools Amp HumPRO Master Dev System 900 MHz

Lifecycle:
Factory Special Order:
Obtain a quote to verify the current price, lead-time and ordering requirements of the manufacturer.
Datasheet:
Product available only to OEM/EMS and design business customers. Product is not shipped to consumers in the EU or the UK. This product will require additional documentation to export from the United States.

In Stock: 2

Stock:
2 Can Dispatch Immediately
Factory Lead Time:
8 Weeks Estimated factory production time for quantities greater than shown.
Quantities greater than 2 will be subject to minimum order requirements.
Minimum: 1   Multiples: 1
Unit Price:
€-.--
Ext. Price:
€-.--
Est. Tariff:
This Product Ships FREE

Pricing (EUR)

Qty. Unit Price
Ext. Price
€226.11 €226.11

Product Attribute Attribute Value Select Attribute
TE Connectivity
Product Category: Sub-GHz Development Tools
Delivery Restrictions:
 Product available only to OEM/EMS and design business customers. Product is not shipped to consumers in the EU or the UK. This product will require additional documentation to export from the United States.
RoHS:  
Development Systems
900 MHz
HUM-A-900-PRO
3.3 V
USB
Sub GHz
Brand: TE Connectivity / Linx Technologies
Packaging: Case
Product Type: Sub-GHz Development Tools
Series: HumPRO
Factory Pack Quantity: 1
Subcategory: Development Tools
Tradename: HumPRO
Unit Weight: 2.275 kg
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Attributes selected: 0

Datasheet

CNHTS:
8543909000
CAHTS:
8517620090
USHTS:
8473301180
MXHTS:
8473300499
ECCN:
5A991.g

Amplified HumPRO™ Master Development System

TE Connectivity / Linx Technologies Amplified HumPRO™ Master Development System is designed to support rapid evaluation and integration of the HumPRO™ wireless UART data transceiver modules in the user’s environment. The 900MHz dev system includes two carrier boards, two programming docks, and two prototype boards. The carrier boards have a HumPRO™ transceiver on a daughterboard with headers. These carrier boards snap into the sockets of the other boards for ease of movement on test boards. 

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