4 Gbit Embedded Solutions

Types of Embedded Solutions
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Results: 303
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 Mfr.
Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity.
Qty. RoHS
GigaDevice GD5F4GM8UEBIGY
GigaDevice NAND Flash
Datasheet
Non-Stocked
Min.: 4,800
Mult.: 4,800

GigaDevice GD5F4GM8UEYJGR
GigaDevice NAND Flash
Datasheet
Non-Stocked
Min.: 3,000
Mult.: 3,000
: 3,000

GigaDevice GD9FS4G8F4DLGI
GigaDevice NAND Flash
Datasheet
Non-Stocked
Min.: 2,100
Mult.: 2,100

GigaDevice GD9FS4G8F4DMGI
GigaDevice NAND Flash
Datasheet
Non-Stocked
Min.: 960
Mult.: 960

GigaDevice GD9FU4G8F3ALGJ
GigaDevice NAND Flash Non-Stocked
Min.: 2,100
Mult.: 2,100

GigaDevice GD9FU4G8F3AMG2
GigaDevice NAND Flash Non-Stocked
Min.: 960
Mult.: 960

GigaDevice GD9FU4G8F3AMGJ
GigaDevice NAND Flash Non-Stocked
Min.: 960
Mult.: 960

GigaDevice GD9FU4G8F4DLGI
GigaDevice NAND Flash
Datasheet
Non-Stocked
Min.: 2,100
Mult.: 2,100

GigaDevice GD9FU4G8F4DMGI
GigaDevice NAND Flash
Datasheet
Non-Stocked
Min.: 960
Mult.: 960

Zentel Japan DRAM DDR3&DDR3L 4Gb, 512Mx8, 1866 at CL13, 1.35V&1.5V, FBGA-78
Datasheet
Non-Stocked Lead-Time 12 Weeks
Min.: 2,090
Mult.: 2,090

Zentel Japan DRAM DDR3 4Gb, 512Mx8, 2133 at CL14, 1.5V, FBGA-78
Datasheet
Non-Stocked Lead-Time 12 Weeks
Min.: 2,090
Mult.: 2,090

Zentel Japan DRAM DDR3L 4Gb, 512Mx8, 2133 at CL14, 1.35V, FBGA-78
Datasheet
Non-Stocked Lead-Time 12 Weeks
Min.: 2,090
Mult.: 2,090

Zentel Japan DRAM DDR3&DDR3L 4Gb, 256Mx16, 1866 at CL13, 1.35V&1.5V, FBGA-96
Datasheet
Non-Stocked Lead-Time 12 Weeks
Min.: 2,420
Mult.: 2,420

Zentel Japan DRAM DDR3&DDR3L 4Gb, 256Mx16, 1866 at CL13, 1.35V&1.5V, FBGA-96, Ind. Temp.
Datasheet
Non-Stocked Lead-Time 12 Weeks
Min.: 2,420
Mult.: 2,420

Zentel Japan DRAM DDR3 4Gb, 256Mx16, 2133 at CL14, 1.5V, FBGA-96
Datasheet
Non-Stocked Lead-Time 12 Weeks
Min.: 2,420
Mult.: 2,420

Zentel Japan DRAM DDR3L 4Gb, 256Mx16, 2133 at CL14, 1.35V, FBGA-96
Datasheet
Non-Stocked Lead-Time 12 Weeks
Min.: 2,420
Mult.: 2,420

Zentel Japan DRAM DDR3&DDR3L 4Gb, 512Mx8, 1866 at CL13, 1.35V&1.5V, FBGA-78, Ind. Temp.
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 2,090
Mult.: 2,090

Zentel Japan DRAM DDR3 4Gb, 512Mx8, 2133 at CL14, 1.5V, FBGA-78, Ind. Temp.
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 2,090
Mult.: 2,090

Zentel Japan DRAM DDR3 4Gb, 256Mx16, 2133 at CL14, 1.5V, FBGA-96, Ind. Temp.
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 2,420
Mult.: 2,420

ISSI DRAM 4G, 1.2V, DDR4, 256Mx16, 2400MT/s @ 16-16-16, 96 ball BGA (7.5mm x13.5mm) RoHS, T&R
Datasheet
Non-Stocked Lead-Time 36 Weeks
Min.: 2,500
Mult.: 2,500
: 2,500
ISSI DRAM 4G, 1.2V, DDR4, 256Mx16, 2400MT/s @ 16-16-16, 96 ball BGA (7.5mm x13.5mm) RoHS, IT, T&R
Datasheet
Non-Stocked Lead-Time 36 Weeks
Min.: 2,500
Mult.: 2,500
: 2,500

ISSI DRAM Automotive (Tc: -40 to +95C), 4G, 1.06-1.17/1.70-1.95V, LPDDR4, 128Mx32, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R
Datasheet
Non-Stocked Lead-Time 40 Weeks
Min.: 2,500
Mult.: 2,500
: 2,500

ISSI DRAM Automotive (Tc: -40 to +105C), 4G, 1.06-1.17/1.70-1.95V, LPDDR4, 128Mx32, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R
Datasheet
Non-Stocked Lead-Time 40 Weeks
Min.: 2,500
Mult.: 2,500
: 2,500

ISSI DRAM Automotive (Tc: -40 to +95C), 4G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx32, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS
Datasheet
Non-Stocked Lead-Time 40 Weeks
Min.: 136
Mult.: 136

ISSI DRAM Automotive (Tc: -40 to +95C), 4G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx32, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R
Datasheet
Non-Stocked Lead-Time 40 Weeks
Min.: 2,500
Mult.: 2,500
: 2,500