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DF57AH-4S-1.2C

Name: Hirose Electric DF57AH-4S-1.2C
Brand: Hirose Connector
SKU: 798-DF57AH-4S-1.2C
Price: 0.33 EUR
Availability: InStock

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Mouser No:

798-DF57AH-4S-1.2C

Mfr. No:

DF57AH-4S-1.2C

Mfr.:

Hirose Connector

Description:

Power to the Board

Datasheet:

DF57AH-4S-1.2C Datasheet

ECAD Model:

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More Information

Learn more about Hirose Connector DF57AH-4S-1.2C

In Stock: 345

Stock:: 345

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On Order:: 6,000

Expected 11/03/2026
Factory Lead Time:: 6

Weeks Estimated factory production time for quantities greater than shown.

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Minimum: 1 Multiples: 1

Unit Price:

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Ext. Price:

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Est. Tariff:

Pricing (EUR)

Qty.	Unit Price	Ext. Price
	€0.335	€0.34
	€0.284	€2.84
	€0.254	€6.35
	€0.235	€23.50
	€0.211	€52.75
	€0.169	€169.00
	€0.157	€471.00
	€0.153	€765.00
	€0.142	€1,420.00

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Hirose Electric
Product Category:	Power to the Board
RoHS:
Product Type:	Power to the Board
Contact Gender:	Socket (Female)
Current Rating:	1.5 A
Voltage Rating:	50 VAC/DC
Number of Positions:	4 Position
Termination Style:	Crimp
Pitch:	1.2 mm
Series:	DF57
Packaging:	Bulk
Tradename:	SnapBee
Brand:	Hirose Connector
Contact Material:	Phosphor Bronze
Contact Plating:	Gold
Insulation Resistance:	100 MOhms
Maximum Operating Temperature:	+ 85 C
Minimum Operating Temperature:	- 35 C
Product:	Wire-to-Board Connectors
Factory Pack Quantity:	1000
Subcategory:	Power Connectors
Wire Gauge Max:	26 AWG
Wire Gauge Min:	28 AWG
Wire Gauge Range:	28 AWG to 26 AWG
Part # Aliases:	666-0113-0-00

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Datasheet

DF57AH-4S-1.2C Datasheet

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CNHTS:: 8536901100
USHTS:: 8536694040
ECCN:: EAR99

Wearable Solutions

Hirose Electric offers a wide portfolio of connectors designed for wearable devices, such as earphones, smart watches, smart glasses, and smart rings. Built for high-speed data, low power consumption, and EMI control, these connectors support reliable integration of displays, sensors, batteries, and antennas in compact, body-worn designs. Hirose Electric connectors are designed for durability and precision and meet the rigorous demands of wearables, where flexibility, space, and signal integrity are critical.