CYW20829B0P4TAI100XUMA1

Infineon Technologies
726-CYW20829B0P4TAI1
CYW20829B0P4TAI100XUMA1

Mfr.:

Description:
Bluetooth Modules - 802.15.1 BLE INDUSTRIAL AND IOT

Lifecycle:
New At Mouser
Datasheet:
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Learn more about Infineon Technologies CYW20829B0P4TAI100XUMA1

In Stock: 3,981

Stock:
3,981 Can Dispatch Immediately
Factory Lead Time:
29 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
€-.--
Ext. Price:
€-.--
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
€7.65 €7.65
€6.64 €66.40
€6.29 €157.25
€5.81 €581.00
€5.51 €1,377.50
Full Reel (Order in multiples of 500)
€5.24 €2,620.00
€5.11 €5,110.00
5,000 Quote

Product Attribute Attribute Value Select Attribute
Infineon
Product Category: Bluetooth Modules - 802.15.1
RoHS:  
I2C, SPI, UART
10 dBm
2 Mb/s
- 95 dBm, - 98 dBm
2.4 GHz
2.75 V
3.6 V
- 30 C
+ 85 C
Reel
Cut Tape
Brand: Infineon Technologies
Core: Arm Cortex-M33
Dimensions: 14.5 mm x 19 mm x 1.95 mm
Features: Low Power
Height: 1.95 mm
Length: 19 mm
Memory Size: 256 kB
Moisture Sensitive: Yes
Mounting Style: SMD/SMT
Operating Supply Voltage: 2.75 V to 3.6 V
Product: Bluetooth Modules
Product Type: Bluetooth Modules
Protocol - Bluetooth, BLE - 802.15.1: Bluetooth LE
Shielding: Shielded
Factory Pack Quantity: 500
Subcategory: Wireless & RF Modules
Supply Current Receiving: 5.6 mA
Supply Current Transmitting: 5.2 mA
Width: 14.5 mm
Part # Aliases: CYW20829B0-P4TAI100 SP005970282
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Attributes selected: 0

Datasheet

TARIC:
8517620000
CNHTS:
8517629990
USHTS:
8517620090
JPHTS:
851762090
ECCN:
5A992.C

AIROC™ BLUETOOTH® & BLUETOOTH LE Modules

Infineon Technologies AIROC™ BLUETOOTH® and BLUETOOTH LE Modules assist users in developing Internet of Things (IoT) design quickly and efficiently. These modules greatly reduce development risk and accelerate time to market. Additionally, the modules are qualified by Bluetooth SIG and have received regulatory certification approval from organizations like FCC, ISED, MIC, and CE. This allows users to focus on creating unique IoT applications without worrying about the complexities of board bring-up, RF/spec testing, performance testing, and regulatory testing.

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