SC18IS606PWJ

NXP Semiconductors
771-SC18IS606PWJ
SC18IS606PWJ

Mfr.:

Description:
Interface - Specialised I2C-bus to SPI bridge

Datasheet:
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Learn more about NXP Semiconductors SC18IS606PWJ

In Stock: 75

Stock:
75
Can Dispatch Immediately
On Order:
7,500
Expected 16/06/2026
5,000
Expected 22/06/2026
Factory Lead Time:
16
Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
€-.--
Ext. Price:
€-.--
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 2500)

Pricing (EUR)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™ †
€3.09 €3.09
€2.33 €23.30
€2.13 €53.25
€1.93 €193.00
€1.82 €455.00
€1.77 €885.00
Full Reel (Order in multiples of 2500)
€1.65 €4,125.00
€1.62 €8,100.00
† A MouseReel™ fee of €5.00 will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable. ↩

Product Attribute Attribute Value Select Attribute
NXP
Product Category: Interface - Specialised
RoHS:  
3.6 V
1.71 V
2.1 mA
- 40 C
+ 105 C
SMD/SMT
TSSOP-16
Brand: NXP Semiconductors
Operating Supply Voltage: 1.71 V to 3.6 V
Packaging: Reel
Packaging: Cut Tape
Packaging: MouseReel
Pd - Power Dissipation: 1.5 W
Product Type: Interface - Specialized
Series: SC18IS606
Factory Pack Quantity: 2500
Subcategory: Interface ICs
Part # Aliases: 935420181118
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Attributes selected: 0

Datasheet

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CNHTS:
8542399000
USHTS:
8542390090
ECCN:
EAR99

SC18IS606 I2C-Bus to SPI Bridge

NXP Semiconductors SC18IS606 I2C-Bus to SPI Bridge is designed to serve as an interface between a standard I2C-bus of a microcontroller and an SPI bus. The I2C-Bus to SPI Bridge allows the MCU to communicate directly with SPI devices through its I2C-bus. The SC18IS606 can also operate as an I2C-bus target-transmitter or target-receiver and an SPI controller. The device can control all the SPI bus-specific sequences, protocol, and timing. The SC18IS606 has its own internal oscillator, and it supports three SPI chip select outputs that may be configured as GPIO when not used as SPI chip select.

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