AP33772DKZ-13

Diodes Incorporated
621-AP33772DKZ-13
AP33772DKZ-13

Mfr.:

Description:
USB Interface IC USB Std Power Range W-QFN4040-24 T&R 3K

Datasheet:
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Learn more about Diodes Incorporated AP33772DKZ-13

In Stock: 6,414

Stock:
6,414 Can Dispatch Immediately
Factory Lead Time:
12 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
€-.--
Ext. Price:
€-.--
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 3000)

Pricing (EUR)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™ †
€1.53 €1.53
€1.13 €11.30
€1.02 €25.50
€0.912 €91.20
€0.857 €214.25
€0.848 €424.00
€0.836 €836.00
Full Reel (Order in multiples of 3000)
€0.782 €2,346.00
€0.765 €4,590.00
† A MouseReel™ fee of €5.00 will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable. ↩

Product Attribute Attribute Value Select Attribute
Diodes Incorporated
Product Category: USB Interface IC
RoHS:  
AP33772
USB Type-C
SMD/SMT
QFN-24
USB-C PD
3.3 V
24 V
3.3 mA
- 40 C
+ 150 C
Reel
Cut Tape
MouseReel
Brand: Diodes Incorporated
Interface Type: I2C
Operating Supply Voltage: 3.3 V to 24 V
Product Type: USB Interface IC
Factory Pack Quantity: 3000
Subcategory: Interface ICs
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Attributes selected: 0

Datasheet

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CNHTS:
8542399000
USHTS:
8542310075
ECCN:
EAR99

AP33772 USB Type-C™ PD Sink Controller

Diodes Incorporated AP33772 USB Type-C™ PD Sink Controller meets USB Power Delivery specification Rev. 3.0 v1.2. Because of its high voltage process, the AP33772 provides a cost-effective USB PD solution without the need for external discrete high-voltage components like LDOs. During the protocol handshake process, packets are transmitted and received through a Biphase Mark Coding (BMC) transceiver with a good eye diagram and high noise immunity. The AP33772 supports I2C communication to implement all of the PD sink functions, such as the requesting of power profiles, Power Device Objects (PDO), and Augmented Power Device Objects (APDO). Rich power functions embedded on the chip reduce the total bill of materials (BOM) while maintaining maximum flexibility. 

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