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L177HRCG62S

Name: Amphenol L177HRCG62S
Brand: Amphenol Commercial Products
SKU: 523-L177HRCG62S
Price: 3 EUR
Availability: InStock

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Mouser No:

523-L177HRCG62S

Mfr. No:

L177HRCG62S

Mfr.:

Amphenol Commercial Products

Description:

D-Sub High Density Connectors 62P Sz C Recpt Hsng Rear Insert M3

Datasheet:

L177HRCG62S Datasheet (PDF)

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In Stock: 232

Stock:: 232 Can Dispatch Immediately

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Factory Lead Time:: 12 Weeks Estimated factory production time for quantities greater than shown.

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Minimum: 1 Multiples: 1

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Ext. Price:

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Pricing (EUR)

Qty.	Unit Price	Ext. Price
	€3.00	€3.00
	€2.84	€28.40
	€2.41	€289.20
	€1.97	€472.80
	€1.93	€1,158.00
	€1.80	€1,944.00
	€1.75	€4,410.00
	€1.70	€8,568.00

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Amphenol
Product Category:	D-Sub High Density Connectors
RoHS:
REACH - SVHC:
Number of Positions:	62 Position
Number of Rows:	3 Row
Gender:	Female
Termination Style:	Crimp
Mounting Angle:	Straight
Packaging:	Tray
Brand:	Amphenol Commercial Products
Filtered:	Unfiltered
Insulation Material:	Thermoplastic
Maximum Operating Temperature:	+ 125 C
Minimum Operating Temperature:	- 55 C
Mounting Style:	Panel
Product Type:	High Density D-Sub Connectors
Shell Material:	Steel
Shell Plating:	Tin
Shell Size:	C
Factory Pack Quantity:	120
Subcategory:	D-Sub Connectors
Unit Weight:	16.048 g

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Datasheet

L177HRCG62S Datasheet (PDF)

Specification Sheets

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TARIC:: 8536699099
CNHTS:: 8538900000
CAHTS:: 8536690040
USHTS:: 8536694030
JPHTS:: 853669000
KRHTS:: 8536699000
MXHTS:: 85366999
BRHTS:: 85366990
ECCN:: EAR99

TW Hybrid D-Sub Connectors

Amphenol Commercial TW Hybrid D-Sub Connectors come in various contact arrangements such as signal, power, shielded, high voltage, and fiber optics. These connectors feature mating interfaces according to MIL C24308, less than 5mΩ contact resistance, and endure temperatures up to 260°C. The TW Hybrid D-Sub connectors are supplied with screw-machined contacts fixed in the insulators. These connectors are suitable for use in commercial, medical, industrial, telecom, and any applications requiring optimization of space.