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1MM-R-D06-VS-00-H-TRP

Name: TE Connectivity 1MM-R-D06-VS-00-H-TRP
Brand: TE Connectivity
SKU: 571-1MMRD06VS00HTRP
Price: 2.08 EUR
Availability: OutOfStock

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Mouser No:

571-1MMRD06VS00HTRP

Mfr. No:

1MM-R-D06-VS-00-H-TRP

Mfr.:

TE Connectivity

Description:

Board to Board & Mezzanine Connectors 2x8P TB HDR HZ (90) 3.5, BK

Datasheet:

1MM-R-D06-VS-00-H-TRP Datasheet

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Availability

Stock:: Non-Stocked

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Factory Lead Time:: 7 Weeks Estimated factory production time.

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Minimum: 900 Multiples: 900

Unit Price:

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Ext. Price:

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Est. Tariff:

Pricing (EUR)

Qty.	Unit Price	Ext. Price
Full Reel (Order in multiples of 900)
	€2.08	€1,872.00
	€2.03	€3,654.00
	€2.00	€9,000.00

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	TE Connectivity
Product Category:	Board to Board & Mezzanine Connectors
RoHS:
Product:	Receptacles
Number of Positions:	12 Position
Pitch:	1 mm (0.039 in)
Number of Rows:	2 Row
Termination Style:	Solder
Mounting Angle:	Vertical
Current Rating:	1 A
Voltage Rating:	30 VAC
Minimum Operating Temperature:	- 55 C
Maximum Operating Temperature:	+ 125 C
Contact Plating:	Gold
Contact Material:	Copper Alloy
Housing Material:	Liquid Crystal Polymer (LCP)
Packaging:	Reel
Brand:	TE Connectivity
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	US
Product Type:	Board to Board & Mezzanine Connectors
Factory Pack Quantity:	900
Subcategory:	Board to Board & Mezzanine Connectors
Part # Aliases:	5-2267440-6

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Datasheet

1MM-R-D06-VS-00-H-TRP Datasheet

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USHTS:: 8536694040
ECCN:: EAR99

AMPMODU 1.0mm Centreline Interconnect System

TE Connectivity's (TE) AMPMODU 1.0mm Centerline Interconnect System offers an 85% space savings on the board when compared to the standard 2.54mm pitch connectors. A dual-beam contact design provides a reliable electrical connection even in severe shock/vibration environments. The TE AMPMODU 1.0mm Centerline Interconnect System serves a broad range of design requirements with up to 100 positions and two plating options with support for automated surface mounting and reflow processes.