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DA14594-000006F2

Name: Renesas Electronics DA14594-000006F2
Brand: Renesas / Dialog
SKU: 968-DA14594-000006F2
Price: 4.53 EUR
Availability: InStock

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Mouser No:

968-DA14594-000006F2

Mfr. No:

DA14594-000006F2

Mfr.:

Renesas / Dialog

Description:

RF System on a Chip - SoC Multi-Core BLE 5.3 SoC with Embedded FLASH

Lifecycle:

New Product:

New from this manufacturer.

Datasheet:

DA14594-000006F2 Datasheet (PDF)

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Learn more about Renesas / Dialog DA14594-000006F2

In Stock: 5,299

Stock:: 5,299 Can Dispatch Immediately

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Factory Lead Time:: 18 Weeks Estimated factory production time for quantities greater than shown.

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Est. Tariff:

Pricing (EUR)

Qty.	Unit Price	Ext. Price
	€4.53	€4.53
	€3.76	€37.60
	€3.49	€87.25
	€3.15	€315.00
	€2.97	€742.50
	€2.86	€1,430.00
	€2.76	€2,760.00
	€2.67	€6,675.00
Full Reel (Order in multiples of 5500)
	€2.67	€14,685.00

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Renesas Electronics
Product Category:	RF System on a Chip - SoC
RoHS:
Core:	ARM Cortex M33
Program Memory Size:	256 kB
Packaging:	Reel
Packaging:	Cut Tape
Brand:	Renesas / Dialog
Data Bus Width:	32 bit
Data RAM Size:	96 kB
Data RAM Type:	RAM
Interface Type:	I2C, SPI, UART
Maximum Clock Frequency:	64 MHz
Moisture Sensitive:	Yes
Product Type:	RF System on a Chip - SoC
Program Memory Type:	Flash
Series:	DA14594
Factory Pack Quantity:	5500
Subcategory:	Wireless & RF Integrated Circuits
Technology:	Si
Tradename:	SmartBond

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Datasheet

DA14594-000006F2 Datasheet (PDF)

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CAHTS:: 8542310000
USHTS:: 8542310070
ECCN:: 3A991.a.2

DA14594 SmartBond Dual-Core BLUETOOTH® LE 5.3 SoC

Renesas DA14594 SmartBond™ Dual-Core BLUETOOTH^® LE 5.3 SoC is a dual-core wireless microcontroller that combines the current Arm^® Cortex^®-M33™ application processor. This processor has a floating-point unit, Cortex-M0+™, advanced power management functionality, a cryptographic security engine, and analog and digital peripherals. It also includes a software configurable protocol engine with a radio that is compliant with the Bluetooth 5.3 Low Energy (LE) standard and 256KB of embedded Flash accompanied by 96KB of RAM, 16KB of cache RAM, and 288KB ROM (containing the Bluetooth LE stack). The embedded Flash or SRAM may be expended externally through QSPI.