PCA9600DPZ

NXP Semiconductors
771-PCA9600DPZ
PCA9600DPZ

Mfr.:

Description:
Buffers & Line Drivers I2C-bus buffer

ECAD Model:
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In Stock: 10,511

Stock:
10,511 Can Dispatch Immediately
Factory Lead Time:
16 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
€-.--
Ext. Price:
€-.--
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 2500)

Pricing (EUR)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™
€3.97 €3.97
€3.02 €30.20
€2.78 €69.50
€2.52 €252.00
€2.39 €597.50
€2.34 €1,170.00
Full Reel (Order in multiples of 2500)
€2.18 €5,450.00
† A MouseReel™ fee of €5.00 will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable.

Product Attribute Attribute Value Select Attribute
NXP
Product Category: Buffers & Line Drivers
RoHS:  
1 Input
1 Output
Non-Inverting
TSSOP-8
- 15 mA
130 mA
1.4 mA
2.5 V
15 V
5.5 mA
- 40 C
+ 85 C
SMD/SMT
Reel
Cut Tape
MouseReel
Brand: NXP Semiconductors
Interface Type: I2C Bus
Logic Type: Bidirectional Bus Buffer
Pd - Power Dissipation: 300 mW
Product Type: Buffers & Line Drivers
Series: PCA9600
Factory Pack Quantity: 2500
Subcategory: Logic ICs
Part # Aliases: 935285244431
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TARIC:
8542399000
CNHTS:
8542399000
CAHTS:
8542390000
USHTS:
8542390090
MXHTS:
8542399999
ECCN:
EAR99

PCA9600 & PCA9601 Dual Bidirectional Bus Buffers

NXP Semiconductors PCA9600 and PCA9601 Dual Bidirectional Bus Buffers are designed to isolate I2C-bus capacitance, allowing long buses to be driven in point-to-point or multipoint applications of up to 4000pF. The PCA9600 and PCA9601 create a non-latching, bidirectional, logic interface between a normal I2C-bus and a range of other higher capacitance or different voltage bus configurations. These devices operate at speeds up to 1MHz, and the high drive side is compatible with the Fast-mode Plus (Fm+) specifications. The PCA9601 features 15mA SX/SY sink capability, yielding a 5V Fm+ bus rise time with 470pF loads.

Logic

NXP Semiconductors Logic portfolio consists of the industry’s smallest, leadless DQFN package for gates, octals, and MSI functions simplifying PCB routing, and the world’s smallest MicroPak™ and Diamond™ packages for single-, dual-, and triple-gate logic. We NXP continually invests in new process and package technologies, as well as new packaging facilities, focus on increasing performance, lowering power consumption, and reducing size and have the largest portfolio of dedicated Q100 devices.