ATS-X50150G-C1-R0

Name: Advanced Thermal Solutions ATS-X50150G-C1-R0
Brand: Advanced Thermal Solutions
SKU: 984-X50150G-C1-R0
Price: 20.09 EUR
Availability: InStock

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Mouser No:

984-X50150G-C1-R0

Mfr. No:

ATS-X50150G-C1-R0

Mfr.:

Advanced Thermal Solutions

Description:

Heat Sinks maxiFLOW Heat Sink+superGRIP Attach, High Performance, T766, 14.25x14.25x12.5mm

Datasheet:

ATS-X50150G-C1-R0 Datasheet (PDF)

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In Stock: 100

Stock:: 100 Can Dispatch Immediately

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Factory Lead Time:: 26 Weeks Estimated factory production time for quantities greater than shown.

Quantities greater than 100 will be subject to minimum order requirements.

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Ext. Price:

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Pricing (EUR)

Qty.	Unit Price	Ext. Price
	€20.09	€20.09
	€18.98	€189.80
	€17.86	€357.20
	€16.74	€837.00
	€15.63	€1,563.00
	€14.81	€2,962.00
	€14.35	€7,175.00

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Advanced Thermal Solutions
Product Category:	Heat Sinks
RoHS:
Product:	Heat Sink Assemblies
Designed for:	BGA
Heatsink Material:	Aluminum
Fin Style:	maxiFLOW
Thermal Resistance:	11.7 C/W
Length:	14.25 mm
Width:	14.25 mm
Height:	12.5 mm
Brand:	Advanced Thermal Solutions
Color:	Blue
Packaging:	Bulk
Product Type:	Heat Sinks
Series:	superGRIP HS ASM
Factory Pack Quantity:	100
Subcategory:	Heat Sinks
Tradename:	maxiFLOW superGRIP
Type:	Component

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Datasheet

ATS-X50150G-C1-R0 Datasheet (PDF)

Test/Quality Data

Certificate of RoHS and REACH 205 Compliance (PDF)

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USHTS:: 7616995190
MXHTS:: 7616995195
ECCN:: EAR99

maxiFLOW™ Heat Sinks

Advanced Thermal Solutions maxiFLOW™ Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. The ATS heat sink design provides high thermal performance for the physical volume it occupies compared to other designs. These ATS cooling solutions are offered in a variety of fin types, including maxiFLOW, straight fin, pin-fin, and cross-cut designs. The straight-fin heat sinks are well-suited for systems with open airflow from front to back. The pin-fin design offers superior cooling in spatially constrained PCB layouts when the airflow direction near the device is ambiguous. The cross-cut fin design allows cooling air to enter from any direction.