It appears you have JavaScript disabled within your browser. Some functions on this page will not work unless you log in.

See an Error?

ATS-MG210-R0

Name: Advanced Thermal Solutions ATS-MG210-R0
Brand: Advanced Thermal Solutions
SKU: 984-ATS-MG210-R0
Price: 6.67 EUR
Availability: InStock

Images are for reference only
See Product Specifications

Mouser No:

984-ATS-MG210-R0

Mfr. No:

ATS-MG210-R0

Mfr.:

Advanced Thermal Solutions

Description:

Heat Sinks clipKIT Attachment Heat Sink to PCB for Component Size 21x21mm, maxiGRIP Tech

Datasheet:

ATS-MG210-R0 Datasheet (PDF)

ECAD Model:

Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.

More Information

Learn more about Advanced Thermal Solutions ATS-MG210-R0

.hidden-for-nojs { display: none; } .pull-right-nojs { justify-content: flex-end; }

Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Advanced Thermal Solutions
Product Category:	Heat Sinks
RoHS:
Product:	Accessories and Hardware
Designed for:	Component, 21x21mm
Mounting Style:	Clip
Length:	21 mm
Width:	21 mm
Brand:	Advanced Thermal Solutions
Packaging:	Bulk
Product Type:	Heat Sinks
Series:	ATS-MG
Factory Pack Quantity:	100
Subcategory:	Heat Sinks
Tradename:	clipKIT maxiGRIP
Type:	Component

Products found:

To show similar products, select at least one checkbox

Select at least one checkbox above to show similar products in this category.

Attributes selected: 0

Filter Document:

Datasheet

ATS-MG210-R0 Datasheet (PDF)

Specification Sheets

maxiGRIP™ Datasheet (PDF)

Technical Resources

Test/Quality Data

Certificate of RoHS and REACH 205 Compliance (PDF)

Videos

Heat Sink Attachments

Compliance Codes

USHTS:: 7326908688
ECCN:: EAR99

Origin Classifications

Country of Origin:: China
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

maxiGRIP™ clipKIT™ Heat Sink Attachments

Advanced Thermal Solutions maxiGRIP™ clipKIT™ Heat Sink Attachments feature a two-component system that quickly and securely mounts heat sinks to a range of hot-running Ball Grid Array (BGA) components. These attachments use a minimal amount of space on a PCB, eliminate the need to drill holes and allow the heat sink to be detached and reattached without damaging the component or PCB in the event the PCB needs to be reworked.