ATS-HK379-R0

Advanced Thermal Solutions
984-ATS-HK379-R0
ATS-HK379-R0

Mfr.:

Description:
Heat Sinks Cooler Backing Plate, High Performance, 96x96x6mm, 80mm Hole to Hole, Aluminum

ECAD Model:
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In Stock: 649

Stock:
649 Can Dispatch Immediately
Factory Lead Time:
13 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
€-.--
Ext. Price:
€-.--
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
€2.99 €2.99
€2.78 €27.80
€2.70 €67.50
€2.55 €127.50
€2.40 €240.00
€2.25 €562.50
€2.18 €1,090.00
€2.07 €2,070.00

Product Attribute Attribute Value Select Attribute
Advanced Thermal Solutions
Product Category: Heat Sinks
RoHS:  
Accessories and Hardware
96 mm
96 mm
Brand: Advanced Thermal Solutions
Product Type: Heat Sinks
Series: ATS-HK
Factory Pack Quantity: 1
Subcategory: Heat Sinks
Type: Backing Plate
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Attributes selected: 0

CAHTS:
8473309000
USHTS:
8473305100
JPHTS:
847330090
MXHTS:
8473300499
ECCN:
EAR99

ATS-HK379-R0 High-Performance Cooler Backing Plate

Advanced Thermal Solutions ATS-HK379-R0 High-Performance Cooler Backing Plate is an optional backing plate that connects CPUs and other high-powered processors to the Ultra-Cool family of high-performance passive and active thermal solutions, including dual-FLOW™ and quadFLOW™. The ATS-HK379-R0 is designed for CPUs, processors, GPUs, AI processors, and FPGAs that fit sockets other than the Intel™ LGA2011 square and LGA2066 (Socket R). This plate comes with an unattached die-cut Formex GK-10 insulator to provide electrical insulation between the board and the backing plate. ATS High-Performance Cooler Backing Plate measures 96mm x 96mm with 70mm x 70mm inner dimensions and is intended for use with 1.57mm thick PCB. The ATS-HK379-R0 easily attaches beneath the PCB for even pressure across the board to prevent cracking or other damage.