ATS-61375R-C1-R0

Advanced Thermal Solutions
984-ATS-61375R-C1-R0
ATS-61375R-C1-R0

Mfr.:

Description:
Heat Sinks BGA fanSINK Assembly w/maxiGRIP Attachment, 36.75x36.75x19.5mm, 36.75mm dia.

ECAD Model:
Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.

In Stock: 60

Stock:
60 Can Dispatch Immediately
Factory Lead Time:
13 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
€-.--
Ext. Price:
€-.--
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
€20.23 €20.23
€19.11 €191.10
€17.98 €359.60
€16.86 €843.00
€15.74 €1,574.00
€14.91 €2,982.00
€14.46 €7,230.00

Product Attribute Attribute Value Select Attribute
Advanced Thermal Solutions
Product Category: Heat Sinks
RoHS:  
Fan Sink Assemblies
BGA
Snap On
Aluminum
Cross Cut Fin
2.2 C/W
37.5 mm
37.5 mm
19.5 mm
Brand: Advanced Thermal Solutions
Color: Black
Packaging: Bulk
Product Type: Heat Sinks
Series: ATS-61
Factory Pack Quantity: 100
Subcategory: Heat Sinks
Tradename: fanSINK maxiGRIP
Type: Component
Products found:
To show similar products, select at least one checkbox
Select at least one checkbox above to show similar products in this category.
Attributes selected: 0

This functionality requires JavaScript to be enabled.

TARIC:
8414591500
USHTS:
8414591500
JPHTS:
841459029
KRHTS:
8414592000
MXHTS:
8414599999
ECCN:
EAR99

fanSINK™ High Performance Heat Sinks

Advanced Thermal Solutions, Inc. (ATS) fanSINK™ High-Performance Heat Sinks feature a cross-cut straight-fin structure that allows for omnidirectional airflow for optimal thermal performance independent of the PCB layout. Depending on their size, the fanSINK can be securely clipped onto a device with the ATS maxiGRIP™ attachment system or by using standoff and spring hardware for direct attachment to the PCB. The stainless-steel screw fan attachment ensures a dependable long-term fan-to-heat sink connection (fan not included). These heat sinks include pre-assembled thermal interface material (TIM) centered on the base to ensure proper thermal transfer between the component and heat sink.