ATS-56011-C4-R0

Advanced Thermal Solutions
984-ATS-56011-C4-R0
ATS-56011-C4-R0

Mfr.:

Description:
Heat Sinks maxiFLOW BGA ASIC Cooling Heat Sink, High Performance, No TIM, 57.5x57.5x12.5mm

Datasheet:
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Learn more about Advanced Thermal Solutions ATS-56011-C4-R0

Availability

Stock:
Non-Stocked
Factory Lead Time:
13 Weeks Estimated factory production time.
Minimum: 100   Multiples: 100
Unit Price:
€-.--
Ext. Price:
€-.--
Est. Tariff:
This Product Ships FREE

Pricing (EUR)

Qty. Unit Price
Ext. Price
€21.33 €2,133.00
€20.95 €4,190.00
€20.94 €10,470.00
1,000 Quote

Product Attribute Attribute Value Select Attribute
Advanced Thermal Solutions
Product Category: Heat Sinks
RoHS:  
Heat Sinks
BGA
Adhesive
Aluminum
Angled Fin
2.3 C/W
57.5 mm
57.5 mm
12.5 mm
Brand: Advanced Thermal Solutions
Color: Black
Packaging: Bulk
Product Type: Heat Sinks
Series: HS with TAPE
Factory Pack Quantity: 100
Subcategory: Heat Sinks
Tradename: maxiFLOW
Type: Component
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Attributes selected: 0

Datasheet

Test/Quality Data

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TARIC:
8542900000
CNHTS:
7616991090
CAHTS:
8542900000
USHTS:
8542900000
JPHTS:
854290000
MXHTS:
8542900100
ECCN:
EAR99

maxiFLOW™ Heat Sinks

Advanced Thermal Solutions maxiFLOW™ Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. This heat sink design provides high thermal performance for the physical volume that they occupy as compared to other heat sink designs. The maxiFLOW heat sinks feature three attachment methods: maxiGRIP™, thermal tape, or push pin. The maxiGRIP™ heat sink attachment applies steady, even pressure to the component and does not require holes in the PCB. The thermal tape mounts the heat sink using a thermally conductive adhesive strip, while the push pin attachment requires holes in the PCB to anchor the heat sink. 

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